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Laser Trimming Services
 

Key Benefits

  1. Make your parts smaller. Today’s relentless drive for miniaturization, particularly in consumer electronics, is fueling the demand for ever-smaller devices. Only laser can handle small-package specs like SOT 20 and SOT 23, which are simply beyond the capabilities of electrical link blowing.
  2. Make your parts more accurate. More accurate parts require more links. But manufacturers can’t afford to enlarge die sizes. Because it eliminates the need for real estate hungry test pads, laser ensures higher accuracy with smaller die sizes.
  3. Ship customer orders faster. With laser, you can fab a single mask with varying levels of device functionality and then wait to customize your wafers when the customer order rolls in. For example, you can pre-manufacture “generic” op-amps, and then use laser link blowing to cut in precise 5 volt or 15 volt functionality depending on what the customer wants. This combines JIT efficiencies with the precision of semiconductor manufacturing.
Description

Enhance circuit performance, boost yields, speed time-to-market, and ensure higher profitability in thin film by laser trimming and link blowing semiconductor and silicon manufacturing.

As today’s consumers demand products that pack higher and higher levels of functionality into smaller and smaller designs, laser trimming and its unique ability to eliminate test pads and create more space on the die for circuits is experiencing a rebirth. For a growing number of manufacturers, using laser systems to trim circuits, blow links, and fine tune performance is now viewed as critical to their ability to carve a competitive advantage or even compete in the increasingly miniaturized world of precision linear integrated circuits.

Our Services

General

  • Passive Resistor Value Adjustment on Thin Film Substrates
  • Linear Motor beam positioning YAG lasers for maximum stability

Types

  • R Networkds
  • Microwave Attenuators
  • Balanced Trims
  • Chip Resistors
  • Three or more Resistors in a loop (Active Guard)
  • Ratio Trims

Uses

  • Hybrid Microcircuits (Conventional, Power, Microwave, Chip resistors)

Materials

  • Thin film on Alumina, Silica, Aluminum Nitride, Beryllia (BeO)

Design Guidelines

  • Standard Resistance Range : 0.1 to 30,000,000 Ohms
  • Standard Tolerance : +-1 %
  • Special Tolerances : +- 0.5 %
  • Thin Film Kerf Width : 8 - 10 um
  • Maximum Probes per Card : 30 each
  • Kerf Debris : None
  • Kerf Bridging : None
Contact Us for pricing
 
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