Instrusoft Engineering provides a wide range of custom
electro-mechanical hardware and software design solutions. Our design
staff can meet your needs for quick turn prototypes to full scale production.
Added with our ability to do PC Board Layout and Embedded Firmware, this
allows us to provide a highly integrated design service that can make
your design a reality very quickly.
We can take an idea for design from concept to reality
and work closely with the customer through out the process. Our staff
has extensive experience designing custom upgrades and retrofit kits for
the semiconductor equipment industry.
Contact us today for further
information on any of these projects.
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Here are some examples of Engineering Design and test solutions that
Instrusoft Engineering has provided: |
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Programmable Temperature Controller |
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Designed, developed and manufactured an advanced custom touchscreen based Temperature Controller. The design included
the graphics HTML software, hardware, firmware and PC/MAC
software using a
special custom graphics processor for the touchscreen,
an embedded 32 bit micro-controller, a backup battery, SD
Card and custom PC/MAC USB based software package.
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RTD Sensor and Heater
Module |
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Designed, developed and manufactured a highly accurate RTD sensor interface and 45W heater controller
for use with the Programmable Temperature Controller. The
design includes an embedded 8 bit micro-controller, a RTD 2
and 4 wire sensor interface, a DC-DC converter and a SPI
communication interface.
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12" Perkin Elmer Sputtering System Upgrade |
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Designed, developed and installed a 12" upgrade to a Perkin Elmer 4451 Sputtering System.
The design included the mechanical, electrical and software
upgrades required to convert a 6" process chamber into a 12"
process chamber to within 5% uniformity.
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Manufacturing Oven Log
Tracking |
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This software package uses to keep track of process time when the
product need to be in the cured oven at certain temperature.
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Gel Cure Oven Log
Tracking |
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This software package uses to keep track of gel cure time in Cold,
Room and Hot temperatures for its blood pressure products.
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IC Evaluation board
design, layout and fabrication |
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Design, layout, fabrication of the Evaluation Board.
Firmware development to provide their customer a package to
evaluate the new chips.
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IC Characterized board
design and fabrication |
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Design, layout, fabrication of the Characterization Board.
Firmware development to provide their customer a package to
evaluate the new design before it goes to market.
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Pressure Sensor Test
System |
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Hardware, Software design and System integrations of the
completed test system that will control switching matrix,
pressure gauges, solenoid valves, temperature chamber to test the product over
temperature and pressure ranges
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Hardware and Software design to interface and control the sputter system.
Completely automated all the processes such as Etching, PreSputter, Deposition...
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Design, layout and fabrication DUT board. Software design
to interface with Instrumentations, Data Acquisition system, Temperature
Oven.
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Design and fabrication of the system that will operate under
vacuum with the temperature of 600C. Software design
to interface with Instrumentations, Data Acquisition system, Temperature
Controllers.
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