|
300mm 4451 Sputtering System Upgrade |
 |
Summary of Specification
- Thin film deposition of up to 3 different targets
- Single 300mm wafer processing using load lock
- 23” diameter, 2kw, water-cooled annular table with the ability to
perform adjustable precision rotation and adjustable table
- Easy reversibility to smaller wafer processing
- Windows based operating system, touch screen based for user interface
- Data logging of alarms and errors
|
| Description |
The 300mm 4451 Sputtering system is a low cost system
upgrade of the 8" substrates 4451
sputtering system for thin film deposition. The system consists of the standard components upgraded to
handle 300mm single wafers. The system contains the latest Windows based software to provide a stylish
user interface.
A high vacuum system with an automated Load Lock for the DC
Magnetron sputtering of Metal stacks. The system is configured
in the sputter down mode. The system is currently able to
deposit metal thin film stacks on 8” substrates. The upgrade
will allow for the deposition of metal thin film stacks onto
one 300mm wafer each load cycle. The system
consists of a cylindrical 304 stainless steel chamber large
enough to accommodate 5 each 8” substrates on the platen. The
upgrade will allow for the deposition of one 300mm
wafer per load cycle. Wafer platen will be continuously
rotatable from 1-10 rpm with circular motion under stationary
magnetrons. Wafer will have individual RF applied for
sputter etch pre-clean and table will be water cooled. During
the sputter etch pre-clean, magnetrons will be shuttered to
avoid contamination. Chamber top plate will contain three (3)
each delta magnetron assemblies for DC magnetron deposition.
Contact Us
for pricing and any custom features required. We can also upgrade your existing 4451 system to handle
300mm thin film processing.
|
|
|
|
|
