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Laser Trimming Services
Instrusoft Engineering offers laser trimming services to enhance circuit performance,
boost yields, speed time-to-market, and ensure higher profitability in thin film semiconductor and silicon
manufacturing.
As today’s consumers demand products that pack higher and higher levels of functionality into smaller
and smaller designs, laser trimming and its unique ability to eliminate test pads and create more space
on the die for circuits is experiencing a rebirth. For a growing number of manufacturers, using laser
systems to trim circuits, blow links, and fine tune performance is now viewed as critical to their ability
to carve a competitive advantage or even compete in the increasingly miniaturized world of precision
linear integrated circuits.
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